Product Development: Womb to Tomb, Cradle to the Grave

Technology Qual -> Node developed & validated -> Product Enablement -> Development Kickoff -> Logic Design -> Physical Design (partitioning/floorplanning/placement & layout) -> DRC -> Review/approve substrate drawings for substrate manufacturing & assembly bringup (tooling: jigs, fixtures, stencils, sockets, etc) -> Tapeout -> FAI -> First Silicon -> Assembly process development, optimization & validation (manufacturing windows & corner studies,material screens, material/equipment/process/recipe readiness) -> EVT builds -> Test charz (defects & yield, pareto of rejects) -> Reliability Charz (AM qual, margin assessment, robustness testing, component & board level testing) -> customer prototype builds -> Qualification -> Production Readiness (process/material specs, bill-of-materials, product flows, vendor lists, capacity & resource planning) -> Production Release through soft ramp -> HVM -> QMP(SPC/CoC) -> EOL