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Friday, May 13, 2016
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Smartphone Components
Antenna + Switch & RFFE, Filter, Duplexer, Amplifier, Transceiver, Baseband, Application Processor [SOC + LPDDR3], Memory [Flash / SSD...
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Molded Embedded Packages seek to overcome warpage concerns and limitations in z-height that conventional PoP type packages suffer from, w...
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Backside processing done at the OSAT on TSV wafers that involves TSV reveal & RDL/C4 interconnect processing, used in 2.5D/3D TSV pac...
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Collect TTF at multiple accelerated stress levels. Fit TTF data to life-distribution (for eg. 2P Weibull) for each stress level, and est...