Benefits:
1.
High density integration facilitating
greater functionality (digital/logic, memory, analog, MEMS, optoelectronics, signal & power management) in
smaller footprint.
2. Improved
memory bandwidth and
power management.
3.
Faster signal speeds &
lower parasitics (noise, crosstalk, latencies, propagation delays, interference)
4.
Modular design & die-partitioning permits use of mixed IC technology, improving product development & supply-chain
flexibility/scalability.
5. Best of both worlds between PoP(= modularity, shorter & less complex development cycles/TTM)& SoC (= increased wiring densities, faster signal speeds, memory/power benefits) type package architectures.
Issues & concerns:
1.
Cost: KGD yield related issues, manufacturing & test complexities drive cost upwards.
2.
Thermal management. While 3D stacked memory (NAND Flash on S/D/RAM) and memory-on-logic(DSP with DRAM, GPU with SRAM) configurations have been successfully demonstrated & mass-produced, logic on logic has largely been beyond reach of thermal envelopes of existing packaging materials.
3.
Manufacturing complexities: Additional processes such as backgrinding, bonding/debonding to carrier wafers & stacking are involved. Considerations include deciding between
via-first, via-middle, via-last flows; F2F, F2B chip-attach schemes;
W2W, D2D, D2W integration configurations. Thin die handling/die-attach and capillary underfill flow in tight interstitial spaces are challenges. PAM/NCP/NCF's with TCB will be needed.
4.
Supply chain / ownership/ business model needs clarity: backgrinding/stacking/bumping/dicing/bonding/debonding operations need clear process owners. Who does what & what if things go wrong-these questions need clear answers.
5.
Design tool kit to address multiple aspects (substrate/SoC design, SI/PI, RF & power management, EDA) is still in the exploratory & pathfinding phase.
6.
Lack of standards across the industry for 2.5D/3D TSV facilitation. These are expected to be developed as needed and customized as required.
No comments:
Post a Comment