Thursday, April 25, 2013

High Density Integration schemes

PoP, SoC & Die Stacking (wire-bonded only, wire-bonded + flip-chip, TSV/TSI 2.5D/3D, F2F FC bonded die).

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Smartphone Components

Antenna + Switch & RFFE, Filter, Duplexer, Amplifier, Transceiver, Baseband, Application Processor [SOC + LPDDR3], Memory [Flash / SSD...