http://reviews.cnet.com/smartphones/htc-one/4505-6452_7-35616143.html HTC One
Pages
- Home
- Cloud & Edge Computing
- Machine Learning & AI
- Microprocessors & Servers
- HDI Packaging Technologies
- Packaging Technologies (CSP, FCXGA, POP)
- Project Management 101
- Six Sigma & Statistics
- Reliability Engineering
- Package Design / Product Development
- 3DIC.ORG [Fan Out]
- 3DIC.ORG [2.5D/3D]
- Semi Accurate
- The Inquirer
- Feedly-Tech
- Semiconductor Packaging
- Advanced Packaging
- Silicon Far East
- Post Silicon Platform Validation
- Online Articles -AI/ML
- Online Articles - Packaging
Search This Blog
Monday, April 22, 2013
Subscribe to:
Post Comments (Atom)
Smartphone Components
Antenna + Switch & RFFE, Filter, Duplexer, Amplifier, Transceiver, Baseband, Application Processor [SOC + LPDDR3], Memory [Flash / SSD...
-
Molded Embedded Packages seek to overcome warpage concerns and limitations in z-height that conventional PoP type packages suffer from, w...
-
L-Gate: Technology/Product Development L-1: Explore / PC1 L 0: Define / PC2 & T/O L 1: Enable/BKM determination L 2: Implement/BK...
-
2 primary flows: CoS and CoW (or CoC) CoW/CoC may be chip-first (attach before interposer MEOL) or chip-last (after interposer MEOL) Ch...
No comments:
Post a Comment