Monday, April 29, 2013

Failure Analysis: Tools & Techniques


Microstructural analysis:
Topography: SEM (low voltage, inelastic collisions, higher resolution, low contrast) /BSE (high voltage, elastic collisions, lower resolution, high contrast)
Morphology: (lattice geometry, crystallographic structure) EBSD/TEM/AFM/STM

Material analysis:
Elemental: EDX/WDX/XRF
Chemical: (structural bonds, oxidation states) AES/XPS/EELS/SIMS/FTIR

Interaction between primary electrons & matter: SEM, TEM, BSE, EBSD, EDX & WDX
Interaction between primary X-Rays & matter: XPS, AES, XRF
Other techniques: Opticals, X-Rays, CSAM, Curve Trace, TDR, IR & thermal imaging, SQUID, LSM (LIVA/OBIC for opens & TIVA/OBIRCH for shorts), x-sections, P-laps & FIB cuts

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