1. Study of the hardware configuration: geometry, design, materials, structure
2. Study of life cycle loads: operational loads (power, voltage, bias, duty cycle) & environmental loads (temperature, humidity, vibration, shock)
3. Stress analysis: Stress-strength distributions/interference, cumulative damage assessment & endurance interference, FMEA, hypothesize failure mechanisms, failure sites & associate failure models, root cause analysis, calculate RPN's to rank & prioritize failures.
4. Reliability assessment: Rel metrics characterization, life estimation, operating/design margin estimation.
5. Interpret & apply results: Design tradeoffs & optimization, ALT planning & development, PHM & HUMS planning.
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