Combines multiple IC's with different functionalities into a single system or sub-system
Allows heterogeneous package integration. May contain surface mount discrete passives, integrated passive devices (IPD), used for analog/RF/mixed signal applications,can mix Si/SiGe/GaAs technolgies
Markets include RF/wireless (amplifiers, antenna, filters, oscillators, switch, GPS, BT), memory (SSD NAND/DDR), automotive (ECU, infotainment & telematics, sensory modules), IoT (microcontrollers, MEMS, power management, sensors & connectivity, mixed signal devices), power modules (PMIC, battery management).
Benefits include improved performance & functionalities at smaller footprint through heterogenous package integration with a modular approach allowing greater flexibility in supply chain & system design/integration during product development - and without the complexities/long cycle times/higher risk of SoC development. This allows faster time to market and reduces total cost of ownership.
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