Advanced Package Integration Implementation

Infineon: eWLB, Freescale: RCP (Redistributed Chip Package) -> First examples of WLFO implementation
STMicroelectronics uses 3D-eWLB
ASE has FOPOP technology
Amkor POSSUM is implementation of Altera's ASIC + FPGA integration

Apple A8/A9 processor is 3D-POP using conventional FC/WB techniques integrating AP and Elpida memory (DDR3/4). Memory is wirebond BGA package stacked on AP that uses FC technology on a laminate substrate
Apple A10 (used in iPhone7) instead uses InFO package technology that combines the LPDDR/memory wirebond BGA package with a FO-WLP that eliminates the need for FC interconnects and replaces the laminate substrate with a RDL, thinning form factor and improving performance by reducing signal path and SI/PI parasitics.

Samsung has DDR4 DRAM modules that stacks multiple chips with 3D TSV integration
Micron has HMC DRAM memory stack that integrates 3D DRAM/DDR memory stack with logic controller with TSV providing high bandwidth memory, implemented in Altera STRATIX and Intel Knight's Landing platforms
AMD Fury Graphics uses Hynix HBM integrated with the ASIC/SoC with 2.5D TSV interconnect based approach.