Search This Blog

Saturday, September 24, 2016

A guideline for NPI milestones







-

No comments:

Post a Comment

Subscribe to: Post Comments (Atom)

Smartphone Components

Antenna + Switch & RFFE, Filter, Duplexer, Amplifier, Transceiver, Baseband, Application Processor [SOC + LPDDR3], Memory [Flash / SSD...

  • Mold Embedded Packages (MEP)
    Molded Embedded Packages seek to overcome warpage concerns and limitations in z-height that conventional PoP type packages suffer from, w...
  • L-Gate methodology
    L-Gate: Technology/Product Development L-1: Explore / PC1 L 0: Define / PC2 & T/O L 1: Enable/BKM determination L 2: Implement/BK...
  • TSV MEOL Process
    Backside processing done at the OSAT on TSV wafers that involves TSV reveal & RDL/C4 interconnect processing, used in 2.5D/3D TSV pac...