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Tuesday, August 30, 2016

Packaging Technology


1st level interconnects: FC or WB

Flip Chip Attach:
MR (SnAg or CuP w/ SOP or CuBOL w/o SOP) w/CUF or MUF
TCFC (TCNCP or TCNCF or TCCUF)

Substrate:
Singulated or strip
ETS or SAP

Package:
BGA, LGA, CSP, POP, QFN, WLP, SiP
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7 comments:

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