As system cooling improves (reducing Rca & Tambient), solution can support larger TDP's.
For any given system cooling, Indium can support larger TDP compared to Poly TIM
For any given TDP, more system cooling (or lower Rca / lower Tamb) is needed for poly TIM solution v/s Indium TIM.
As power increases, case temperature has to be progressively lowered through system cooling, to maintain the same junction temperature. When the power increases, and the case temperature is not controlled (effectively by the system cooling), then junction temperature will rise.
When junction temperature exceeds a certain pre-set threshold (usually Tjmax), DVFS will trigger, reducing voltage and frequency, in turn reducing power (and computing performance), and thereby bringing the junction temperature down.
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