Search This Blog

Thursday, August 13, 2015

Power cycling


Motherboard, mux board & fan controller board - design & fabrication, DAQ system, Labview software, package + socket + heat sink + wind tunnel/flow channel, system integration, system setup & debug, calibration & testing.
-
Labels:

No comments:

Post a Comment

Subscribe to: Post Comments (Atom)

Smartphone Components

Antenna + Switch & RFFE, Filter, Duplexer, Amplifier, Transceiver, Baseband, Application Processor [SOC + LPDDR3], Memory [Flash / SSD...

  • Mold Embedded Packages (MEP)
    Molded Embedded Packages seek to overcome warpage concerns and limitations in z-height that conventional PoP type packages suffer from, w...
  • L-Gate methodology
    L-Gate: Technology/Product Development L-1: Explore / PC1 L 0: Define / PC2 & T/O L 1: Enable/BKM determination L 2: Implement/BK...
  • 2.5D flows: CoW v/s CoS
    2 primary flows: CoS and CoW (or CoC) CoW/CoC may be chip-first (attach before interposer MEOL) or chip-last (after interposer MEOL) Ch...