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Sunday, August 16, 2015

TCNCP process profile


Tpre-heat -> Tstage ->Initial high speed approach upto search height -> Approach at search speed -> Contact (min force)-> Force ramp to max force (pressurization), bond head temp increased from stage (standby) temp to Tcontact -> temp ramp to Tpeak or Tcure ->cooldown and head disengagement.
Tbond-head(standby) = T stage -> to minimize any risk of NCP entrapment
Tbond-head(standby) = T contact -> for best throughput
Tbond-head(standby) > T contact -> risk of NCP entrapment
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