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Monday, May 13, 2013
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Smartphone Components
Antenna + Switch & RFFE, Filter, Duplexer, Amplifier, Transceiver, Baseband, Application Processor [SOC + LPDDR3], Memory [Flash / SSD...
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Molded Embedded Packages seek to overcome warpage concerns and limitations in z-height that conventional PoP type packages suffer from, w...
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L-Gate: Technology/Product Development L-1: Explore / PC1 L 0: Define / PC2 & T/O L 1: Enable/BKM determination L 2: Implement/BK...
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2 primary flows: CoS and CoW (or CoC) CoW/CoC may be chip-first (attach before interposer MEOL) or chip-last (after interposer MEOL) Ch...
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