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Friday, May 13, 2016
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Smartphone Components
Antenna + Switch & RFFE, Filter, Duplexer, Amplifier, Transceiver, Baseband, Application Processor [SOC + LPDDR3], Memory [Flash / SSD...
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Molded Embedded Packages seek to overcome warpage concerns and limitations in z-height that conventional PoP type packages suffer from, w...
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1st level interconnects: FC or WB Flip Chip Attach: MR (SnAg or CuP w/ SOP or CuBOL w/o SOP) w/CUF or MUF TCFC (TCNCP or TCNCF or TCC...
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2 primary flows: CoS and CoW (or CoC) CoW/CoC may be chip-first (attach before interposer MEOL) or chip-last (after interposer MEOL) Ch...